Anti-static FR4 epoxy sheet / EPGC202 sheet with high surface resistivity
Anti-static FR4 epoxy sheet are made of woven glass cloth impregnated with epoxy thermosetting resin,laminated under high temperature and high pressure ,the woven glass cloth shall be alkali-free and treated by silane couple.
Feature:
High precision for the tolerance
Excellent Fire Retardant(UL 94 V-0 Grade)
Excellent Voltage Resistance(electric strength ≥16KV/mm)
Excellent Water Resistance(Water absorption ≤0.2%)
Excellent Heat Resistance(Class F)
Excellent thermal impact resistance(Temp.Index:-273℃ to +155℃)
Excellent mechanical processability & high degree of automation processing
RoHS,Reach Certified products
Application:
UL certified FR4 epoxy sheet with low water absorbtion used as the insulating structure parts in class B-h electric motors,electric equipments,which has flame resistance requirements or not,or other applications.
Thickness:0.2mm-120mm
Hong Cheng Grade | HC-FR4-BK&W-JD | |||
Item | Test method | Unit | Typical Values | |
Physical Properties | Color | Visual inspection | - | black + white |
Specific Gravity | IEC 60893-2:2003 | g/cm3 | 1.90 - 2.15 | |
Water absorption | ISO 62:2008 | % | <0.3 | |
Electrical Properties | Volume Resistivity | IEC 60093:1980 | Ω.m | 1.0×106~9 |
Surface Resistivity | IEC 60093:1980 | Ω | 1.0×106~9 | |
Flexural Strength ┴ | IEC 60893-2:2003 | MPa | ≥ 340 | |
Mechanical Properties | Charpy Impact strength // | IEC 60893-2:2003 | KJ/m2 | ≥60 |
TensileStrength | IEC 60893-2:2003 | MPa | ≥300 | |
Bond Strength // | IEC 60893-3-4:2003 | N | ≥8000 | |
Compressive Strength┴ | IEC 60893-2:2003 | MPa | ≥ 350 | |
Flame Resistance Properties | Flame resistance | IEC 60893-2:2003 | ﹍ | HB |
Temperature Index | IEC 60085:2004 | ℃ | 155 | |
Toxicant Content | E662 | ﹍ | Low | |
Others | Acetone Resistance | boiled | Min | 30(OK) |
Anti-static FR4 epoxy sheet used in Rigid circuit board,FPC
Description: |
Flexible Printed Circuit Board is also called FPC,is kind of printed circuit made of flexible insulating substrate. FPC meets the design requirements of smaller and higher density which helps to reduce the assembly process and increased reliability.FPC is the only way to solve the The miniaturization of electronic products,free to bend,wind,fold for million times but won't damage the conductor,it can move in three-dimensional space and scale.So as to achieve integration of the components assembly and wire connection. Pultruded fiberglass tube has excellent Fire Retardant,excellent Voltage Resistance,excellent Heat Resistance,excellent Heat Resistance(Class F),excellent mechanical processability & high degree of automation processing,FR-4 sheet and FR-2 Bakelite plate are good materials for Rigid circuit board,FPC. |